
Manufacturing Challenges in Electronic Packaging
by Y. C. Lee
EngineeringMachineryElectronic packagingManufacturing processes
This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.
Writing a summary for young readers…
For young readers
Book data: Open Library