Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

by Yue Ma, Christian Gontrand

Integrated circuitsThree-dimensional integrated circuitsCircuits intégrés tridimensionnelsTECHNOLOGY & ENGINEERINGMechanicalCOMPUTERSNetworkingGeneral

For young readers

Book data: Open Library