Mechanics of hard films on soft substrates

Flexible electronics have been developed for various applications, including paper-like electronic readers, rollable solar cells, electronic skins etc., with the merits of light weight, low cost, large area, and ruggedness. The systems may be subject to one-time or repeated large deformation during manufacturing and application. Although organic materials can be highly deformable, currently they are not able to fulfill every electronic function. Therefore flexible electronic devices are usually made as organic/inorganic hybrids, with diverse materials, complex architecture, and micro features. While the polymer substrates can recover from large deformations, thin films of electronic materials such as metals, silicon, oxides, and nitrides fracture at small strains, usually less than a few percent. Mechanics of hard films on soft substrates hence holds the key to build high-performance and highly reliable flex circuits. This thesis investigates the deformability and failure mechanisms of thin films of metallic and ceramic materials supported by soft polymeric substrates through combined experimental, theoretical, and numerical methods. When subject to tension, micron-thick metal film