Michael Pecht
Books
- Reliability of Power Electronic Converter Systems
- Guidebook for Managing Silicon Chip Reliability
- Physical architecture of VLSI systems
- Handbook of electronic package design
- Prognostics and health management of electronics
- Electronic Packaging Materials and Their Properties
- Plastic-encapsulated microelectronics
- Quality Conformance and Qualification of Microelectronic Packages and Interconnects
- The Japanese electronics industry
- Placement and routing of electronic modules
- Soldering processes and equipment
- Product Maintainability Supportability Handbook
- Korean Electronics Industry
- The Chinese electronics industry
- Product reliability, maintainability, and supportability handbook
- Electronic packaging materials and their properties
- Handbook of Electronic Package Design (Mechanical Engineering (Marcell Dekker))
- China's electronics industry
- Placement and Routing of Electronic Modules
- Reliability Monitoring Using Sensor Technologies
- Rare earth materials
- Lead-free electronics
- Electronics Industry in Taiwan
- Life-cycle forecasting, mitigation assessment, and obsolescence strategies
- Parts Selection and Management
- Contamination of electronic assemblies
- Electronic packaging reliability
- Guidebook for managing silicon chip reliability
- Parts Selection and Management
- Prognostics and Health Management of Electronics
- Product reliability, maintainability, and supportability handbook
- Integrated circuit, hybrid, and multichip module package design guidelines
- China's Electronics Industry
- Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
- The Korean electronic industry
- Advanced routing of electronic modules
Author data: Open Library