Quality Conformance and Qualification of Microelectronic Packages and Interconnects

All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost-effective products should know that the paradigm has shifted. It has shifted away from the MIL-STDs and other government standards and test procedures that don't cost-effectively address potential failure mechanisms or the manufacturing processes of the product. It has shifted decisively towards tackling the root causes of failure and the appropriate implementation of cost-effective process controls, quality screens, and tests. This book's groundbreaking, science-based approach to developing qualification and quality assurance programs helps engineers reach a new level of reliability in today's high-performance microelectronics. It does this with powerful techniques for identifying and modeling failure mechanisms earlier in the design cycle, breaking the need to rely on field data; physics-of-failure product reliability assessment methods that can be proactively implemented throughout the design and manufacture of the product; and process controls that decrease variabilities in the end product and reduce end-of-line screening and testing. A wide range of microe